FlexiMetal TIM

FlexiMetal-9.1 is a patented very high thermal conductivity metallic thermal interface material. It is designed to be used between a heat sink and a heat source such as a CPU, GPU, AI Chip or power electronics and provide an ultra low thermal resistance path from the heat source to the heat sink. It can be used under the lid or the shield can as TIM1; with a bare die as TIM1.5; or on top of the lid as TIM2. As against the typical liquid metals like pure Gallium and other Gallium, Indium based products which are completely liquid and have very low viscosity, FlexiMetal-9.1 is highly viscous material. High viscosity helps in keeping the material in place and significantly reduces the risk of migration of the material. This proprietary material is a non-eutectic alloy composite and within the normal operating temperatures of the semiconductor products, it exists in between its completely solid and partially molten state.

Applications

FlexiMetal Thermal Interface Materials (TIMs) are widely used across various industries due to their superior thermal conductivity and low bond line thickness. Below are the key applications:

Tips for Using FlexiMetal TIMs

Product Specifications

3.35
Property FlexiMetal TM Testing Method
Type of Product Soft Metal -
Color Silvery Visual
Thermal Impedance, BLT ~ 80 micron ~0.02 -
Density (g/ml)7.0 ASTM D792
Viscosity at Shear rate of 10 s-1 (Pa -s) ~100 ASTM D2196
Melting Point (°C) ~ 7 -
Boiling Point (°C) ~ 2200 -
Thermal Performance
Thermal Conductivity (W/m-K) 35 ASTM D5470

Download Product Data Sheet

Detailed Product Explanations and Applications


FlexiMetalTM

Overview

FlexiMetal-9.1 is a patented very high thermal conductivity metallic thermal interface material. It is designed to be used between a heat sink and a heat source such as a CPU, GPU, AI Chip or power electronics and provide an ultra low thermal resistance path from the heat source to the heat sink.

Applications

  • High heat flux cooling of bare dies in laptops. Can be used to reduce the noise from the laptop
  • Perfect for high-performance applications in consumer electronics, automotive sectors, and data centers where optimal thermal performance is required.
  • Cooling of server CPUs
  • Cooling of high power AI chips with MCM
  • High power cooling of networking switch processors
  • Reduce thermal resistance from chip to the system to improve transient performance of the devices such as smartphones
  • Under the lid (TIM1) applications for various processors, high power controllers
  • Power electronics – can be applied for IGBT Cooling

Differences

Unlike the grease products, FlexiMetal utilizes a soft metal composition, allowing for better conformability and improved thermal performance at lower thicknesses. Its unique properties enable it to fill gaps more effectively.

Tips

  • Handle with care to avoid contamination or oxidation of the metal surface.
  • Apply evenly to ensure effective thermal contact with components.
  • Capable of withstanding high temperatures – up to 250 °C
  • Can be screen-printed 0.02-0.2+ mm thickness